{"title":"Electronic Packaging","description":null,"products":[{"product_id":"3d-microelectronic-packaging-springer-verlag-singapore-9789811570926-from-architectures-to-applications-yan-li","title":"3D Microelectronic Packaging","description":"\u003cp\u003eDiscover the essential resource for understanding the intricacies of 3D microelectronic packaging with \u003cstrong\u003e3D Microelectronic Packaging\u003c\/strong\u003e by \u003cstrong\u003eYan Li\u003c\/strong\u003e. Published by \u003cstrong\u003eSpringer Verlag\u003c\/strong\u003e in 2021, this second edition spans an impressive \u003cstrong\u003e622 pages\u003c\/strong\u003e and serves as a comprehensive reference guide for both graduate students and industry professionals. \u003c\/p\u003e \u003cp\u003eDelve into the fundamentals, architectural designs, processing techniques, and various applications of 3D microelectronic packaging. This book not only enhances your theoretical knowledge but also provides practical insights, making it an invaluable addition to your academic and professional library. Whether you are looking to deepen your understanding or stay updated with the latest advancements in the field, \u003cstrong\u003e3D Microelectronic Packaging\u003c\/strong\u003e is the perfect companion for your journey in microelectronics.\u003c\/p\u003e","brand":"Yan Li","offers":[{"title":"Default Title","offer_id":52281100271958,"sku":"9789811570926","price":193.99,"currency_code":"EUR","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9789811570926.jpg?v=1767826962"}],"url":"https:\/\/www.laufgard.com\/collections\/electronic-packaging.oembed","provider":"Bookshop","version":"1.0","type":"link"}