• Book cover of: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology. By: John H. Lau

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

John H. Lau

€181,87
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Autorius John H. Lau
Leidimo metai 2024 m.
Puslapių skč. 501 psl.
Viršelis Kietas viršelis
ISBN 9789819721399

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by John H. Lau.

Published by Springer, (2024), Hardback, 501 pages.

Book cover of: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology. By: John H. Lau

Flip Chip, Hybrid Bonding, Fan-In, an...

€181,87
€181,87 €187,49