• Book cover of: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging. By: Xing-Chang Wei

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Xing-Chang Wei

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Autorius Xing-Chang Wei
Leidimo metai 2020 m.
Puslapių skč. 322 psl.
Viršelis Minkštas viršelis
ISBN 9780367573669

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power

Book cover of: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging. By: Xing-Chang Wei

Modeling and Design of Electromagneti...

€58,19
€58,19 €59,99