• Book cover of: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging. By: Xing-Chang Wei

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Xing-Chang Wei

€175,81
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Autorius Xing-Chang Wei
Leidimo metai 2017 m.
Puslapių skč. 322 psl.
Viršelis Kietas viršelis
ISBN 9781138033566

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Book cover of: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging. By: Xing-Chang Wei

Modeling and Design of Electromagneti...

€175,81
€175,81 €181,25