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Technological Innovation for Connected Cyber Physical Spaces

Luis M. Camarinha-Matos

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Leidimo metai 2023 m.
Puslapių skč. 302 psl.
Viršelis Kietas viršelis
ISBN 9783031360060
Leidimas 2023 ed.

Technological Innovation for Connected Cyber Physical Spaces

Discover the cutting-edge insights in "Technological Innovation for Connected Cyber Physical Spaces," authored by Luis M. Camarinha-Matos. This 2023 edition, published by Springer International Publishing AG, spans 302 pages and presents the refereed proceedings of the 14th IFIP WG 5.5/SOCOLNET Advanced Doctoral Conference on Computing, Electrical and Industrial Systems (DoCEIS 2023), held in Monte da Caparica, Portugal, from July 5-7, 2022. The book features 22 meticulously reviewed full papers selected from a competitive pool of 47 submissions, making it an essential resource for researchers and practitioners in the field. Dive into the latest advancements and explore the intersection of technology and cyber-physical systems, enhancing your understanding of this rapidly evolving domain. Perfect for anyone looking to stay ahead in technological innovation!

Book cover of: Technological Innovation for Connected Cyber Physical Spaces. By: Luis M. Camarinha-Matos

Technological Innovation for Connecte...

Regular price €109,12
Sale price €109,12 Regular price €112,49