Three-Dimensional Integration and Modeling

Discover the cutting-edge world of electronics with Three-Dimensional Integration and Modeling by Jong-Hoon Lee. Published by Springer International Publishing AG in 2007, this insightful paperback spans 108 pages and delves into advanced technologies for millimeter-wave passive front-ends.

This book covers essential topics such as three-dimensional packaging in multilayer organic substrates, microstrip-type integrated passives, and innovative cavity-type integrated passives. Additionally, it explores three-dimensional antenna architectures and fully integrated three-dimensional passive front-ends, making it an invaluable resource for professionals and students alike.

Whether you're looking to enhance your understanding of modern electronic design or seeking practical applications of three-dimensional integration, Jong-Hoon Lee's expert insights will guide you through the complexities of this evolving field. Don't miss the opportunity to enrich your knowledge with this comprehensive resource!